The new iStack is capable of providing up to 30% productivity increases over the current generation of die bonding products. The new iStack joins ICONN and CONNX in Kulicke and Soffa’s Power Series line of new bonding equipment. The Power Series products set new standards for performance and ease of use for decreased cost of ownership. The company officially introduced the new iStack at SEMICON China 2009, held at the Shanghai New International Expo Centre from March 17 to March 19, 2009, Shanghai PRC.
Following the introduction of the new iStack, the company anticipates to conduct a series of evaluations with the customers over the next few months.
Commenting on the announcement, Scott Kulicke, chairman and chief executive officer of K&S, stated “We expect iStack to reset the standards in die bonding for its targeted applications and to increase our share of the overall die bonding market. iStack represents a continuation of the K&S tradition of producing more than just the industry’s best hardware. iStack provides process capability and is backed by the best engineering support and technical resources available in our market. iStack will advance our customers’ capabilities and reduce their costs. Even in this period of economic uncertainty our customers continue to evaluate the most advanced products for their future needs. For advanced stacked die and high performance BGA applications, iStack is that product.”
