Hynix Semiconductor Unveils 2Gb Low Power DDR2 DRAM

This product works at 1,066Mbps, and provides a high density mobile DRAM offering in MCP(Multi Chip Package) or PoP(Package on Package) types.

The company said that the device operates at a low voltage of 1.2V and processes up to 4.26Gb of data per second with a 32bit I/O, providing high bandwidth. The company claimed that it consumes 50% less power than existing mobile memory offering’s case.

The product meets JEDEC standards and is designed for the use in the next generation smartphone, smartbook and tablet PC applications. Hynix plans to start volume production of this product in the first half of this year in order to satisfy the increasing demand on high density mobile DRAMs for mobile applications.

Since its first introduction of 2Gb mobile DDR using 50nm class process technology in 2008, Hynix has been supplying for a wide range of mobile applications.

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