The telecommunications industry is under intense pressure to integrate multiple traffic types, said Jag Bolaria, senior analyst for The Linley Group. The LSI LLP makes integration both economically and technically feasible on a broad scale.
Until now, telecom OEMs had to purchase and integrate individual cards for each major service type. The LSI LLP runs on a common, highly scalable hardware and software platform, reducing both development time and the number of cards needed to provide multiple network services. OEMs are now able to leverage a single design effort across multiple applications such as wireless base stations, wireless transport and high-end radio network controllers.
The complex mix of protocols and applications that run on today’s advanced networks require highly integrated, state-of-the-art, multi-core SoCs with proven software, said Jim Anderson, vice president of sales and marketing, Semiconductor Solutions Group, LSI. Our latest generation LLP provides OEMs with a single, scalable, highly efficient platform which enables them to build multi-service base stations that span 2G, 3G and 4G networks.
In wireless applications, the LLP SoC supports backhaul of both BTS (2G) and Node B (3G) traffic to BSC (2G) and RNC (3G). Similarly, the new multi-core LLP enables the transport of multiple legacy protocols across wireline packet networks. Network uptime is maximized because the LLP continues to operate WAN modules in the event of system reboot and switches automatically to backup capacity if a system failure occurs that would otherwise impact traffic. The result is a highly efficient, highly available network capable of delivering multiple, any-to-any services.
The LLP SoC provides a broad range of multi-service support including Metro Ethernet, IP, MPLS, edge-to-edge pseudo-wire emulation (PWE3) using CESoPSN, SAToP, ATM, TC/IMA, HDLC/MLPPP, AAL1, frame relay and Transcoder Rate Adaptation Unit (TRAU) protocols.
The new LSI link layer processor is available now. LSI will showcase its wireless infrastructure solutions in stand AV53 at the GSMA Mobile World Congress in Barcelona, Spain, February 16 to February 19, 2009. The LSI stand will be located in the Avenue Pavilion near Hall 8 of the exhibition.
