The company said that the recent launch of Intel’s Xeon processor 5600 Series and Xeon 7500 processors support the industry demand in server applications, especially when paired with DDR3 memory.
Samsung’s DDR3 enables OEMs to use up to 192GBs on a Xeon 5500 platform (16GBx12) with at least a 73% improvement in power consumption at 1.35V, when accompanied by the Xeon 5600 processor, the company claimed.
DDR3 has double the memory bandwidth of DDR2, with speeds up to 1333 Megabits per second (Mbps). With the new Xeon 7500 platform, OEMs can use up to 1 terabyte per 4-socket system and with more sockets, can scale to memory densities 2TBs and higher.
Later this year, Samsung’s 4GB DDR3 chips and modules also will be available for use with the latest Xeon platforms and processors.
Samsung’s DDR3 supports the low power requirements of a wide range of server applications such as streaming media content delivery, on-line transaction processing internet data centers, and virtualization in data centers, and future cloud computing architectures.
Samsung’s DDR3 devices include 1GB, 2GB and 4GB DRAM chips and 1GB, 2GB, 4GB, 8GB, 16GB and 32GB registered DIMMs (dual in-line memory modules) and 1GB, 2GB, 4GB and 8GB ECC unbuffered DIMMs.
The 40nm-class DDR3 chips are available at speeds of 800Mbps, 1066Mbps, 1333Mbps and 1600Mbps and can offer up to a 40% power savings at 1333Mbps, compared to 60nm-class DDR3 chips, the company added.
Jim Elliott, vice president of memory marketing at Samsung Semiconductor, said: “When used in conjunction with use of the Xeon processor 5600 series and the 5500 and 7500 platforms, DDR3 is designed to dramatically improve the efficiency of data transactions while lowering power consumption in virtually any enterprise server application.
”Our low-power DDR3 solutions will play a pivotal role in advancing the design of new-generation, ‘green’ servers.”
