The EClamp2465T integrates four external components onto a single die to provide line termination and protection, reducing the number of components in ultra thin smartphone designs. It also combines three series impedance matching resistors for SIM card line termination. The part offers a low capacitance of 10pF for data integrity on the high-speed lines, and a low clamping voltage for maximum ESD protection.
One important advantage of the part is its Semtech leadless package (SLP1713P8T), which offers the same small, low profile design as flip chip alternatives, but with increased manufacturing durability. The chip measures 1.7 x 1.3 x 0.40 mm with a 0.40 mm pitch for ultra-thin smartphone designs.
The part is a member of Semtech’s EMIClamp family of circuit protection products that are marked by their small size and use of Semtech’s solid-state silicon-avalanche technology for superior clamping performance.
The EClamp2465T solves a unique challenge for designers, offering one of the first packaged ICs for an application that most designers now tackle using a combination of discrete components, said Rick Hansen, Semtech marketing director for Protection Products. Next generation smartphone designs are smaller and will include much more functionality, making the board space savings of this part a key benefit.
The EClamp2465T comes in a lead-free package and is RoHS and WEEE compliant.
Key Features of the EClamp2465T;
Bidirectional EMI/RFI filter with integrated TVS for ESD protection;
ESD protection to IEC 61000-4-2 (ESD) Level 4 (15kV (air), 8kV (contact));
TVS working voltage: 5V;
Termination Resistors: 100 Ohms & 47 Ohms;
Capacitance: 10pF (Typical at VR = 0V);
Protection and filtering for four lines.
