Haddad’s team includes top engineers and scientists, each one of them with decades of experience in design, development and mass production of image sensors from companies like Micron Technology, Inc., Hewlett Packard Company, Agilent Technologies Inc., Avago Technologies Ltd. and Texas Instruments Inc.
During his tenure with MagnaChip, Haddad managed the development of 2.2, 1.7, and 1.4 um pixel technologies and released the first 1.75 um color BSI sensor in 2007. Before MagnaChip, he spent more than 20 years at the Hewlett Packard Company and Agilent where he held various technology management and engineering roles.
SiOnyx chief executive officer Stephen Saylor said, “SiOnyx is fortunate to have acquired such outstanding talent with combined experience of more than 50 years in the image sensing and detecting market. Industry interest in devices made from black silicon is very encouraging, and Dr. Haddad and his team will be instrumental in accelerating the delivery of new products to market.”
The company is producing the devices that represent the first and the only known, low cost, highly scalable platform for the hyper-spectral imaging. The company’s implant method is compatible with the established semiconductor manufacturing processes and introduces no new material.
“Black silicon offers incredible promise in the sensing and detecting markets where engineers have suffered for decades with the limited response of silicon,” said Haddad. “It’s 100 times more sensitive to light and incredibly thin, making Black Silicon a true breakthrough in the development of smaller, cheaper, high performance imaging systems.”
