“This is an important win for Tegal Corporation and for our DRIE 3200 Advanced ICP System, confirming as it does both Tegal’s DRIE technical leadership and Tegal’s added value providing customers with reliable, production-worthy DRIE tools and superior post-sales customer support,” said Peter Dijkstra, vice president of global sales, Tegal. “Our customer chose Tegal after a head-to-head competition weighing silicon DRIE process results and industry references regarding equipment supplier reputations for customer support and service. Our customer concluded Tegal’s value proposition for DRIE cluster tool systems is second to none in the industry, and we are pleased to have been chosen for this silicon DRIE tool order as a result.”
MEMS sensor manufacturing is expected to demonstrate continued growth in the near-term, as MEMS sensors become more and more embedded in smartphone, consumer electronic, medical diagnostic and automotive applications. Silicon DRIE processing is at the heart of MEMS sensor manufacturing, and is also becoming an increasingly important process application for modern power device fabrication. The company’s DRIE 3200 cluster tool system is high-density plasma etch tool featuring an inductively coupled plasma etch reactor and magnetic plasma confinement. The tool can run the company’s patented SHARP, super high aspect ratio process, achieving etched feature aspect ratios of over 100:1 in production environments. Together with its high reliability, broad process window, and high etch rates, the Tegal DRIE 3200 system is a critical enabler for etching the Silicon and SOI substrates found in the MEMS/MOEMS, Power Device, photovoltaic, bio-tech, and hi-voltage markets.
